2.0 mm L- and T-Plate for Finger Joint Fixation | Head & Shaft Small Fragment Orthopedic Plate

Description

The L- and T-Plate 2.0 mm for finger joint fixation is a specialized orthopedic implant engineered to meet the demanding requirements of small bone fracture management. Designed for use in finger joint head and shaft fractures, this plate provides a reliable fixation solution where precision, stability, and minimal soft-tissue disruption are critical.

The plate features a 2-hole head and 2-hole shaft configuration, allowing surgeons to achieve controlled compression and rotational stability while preserving bone vascularity. The L and T shapes support anatomical alignment in complex fracture patterns, particularly in phalangeal and metacarpal regions where space is limited and precision is essential.

Manufactured with a low-profile design, the L- and T-Plate 2.0 mm reduces implant prominence and minimizes postoperative irritation. The smooth surface finish supports soft tissue compatibility, while the optimized hole geometry allows accurate screw angulation and secure fixation.

This plate system is available in left, right, and oblique variants, enabling surgeons to select the most appropriate orientation based on fracture morphology and surgical approach. Its versatile design makes it suitable for a wide range of hand and finger trauma cases, including intra-articular and peri-articular fractures.

The 2.0 mm system size is ideal for small fragment fixation, offering sufficient strength without compromising delicate bone structures. The plate is compatible with both stainless steel and titanium materials, providing flexibility in clinical preference and imaging compatibility.

Commonly used in hand surgery, finger joint reconstruction, and small bone trauma fixation, the L- and T-Plate 2.0 mm ensures predictable outcomes, stable healing, and early mobilization. Its precise engineering and anatomical contouring make it a dependable choice for surgeons seeking consistent performance in small joint orthopedic procedures.